Amtech SynTech-LF-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. Amtech SynTECH-LF-TF may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.
Product Highlights
- ROL0 flux classification
- Wide process window
- Excellent wetting compatibility on most board finishes
- Clear residue
- Low voiding
- REACH compliant
Compatible Alloys
|
Alloy |
Temp °C |
Temp °F |
|
42Sn/58Bi |
138 |
280 |
|
42Sn/57Bi/1Ag |
138 |
280 |
|
96.5Sn/3.0Ag/0.5Cu |
217-220 |
423-428 |
|
99.0Sn/0.3Ag/0.7Cu |
217-221 |
423-430 |
|
96.5Sn/3.5Ag |
221 |
430 |
|
99.3Sn/0.7Cu |
227 |
441 |
|
95Sn/5Sb |
235-240 |
455-464 |
|
95Sn/5Ag |
221-245 |
430-473 |
Test Results
|
Test J-STD-004 or other requirements (as stated) |
Test Requirement |
Result |
||
|
Copper Mirror |
IPC-TM-650: 2.3.32 |
L: No breakthrough |
||
|
Corrosion |
IPC-TM-650: 2.6.15 |
L: No corrosion |
||
|
Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
L: <0.5% |
||
|
Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (no-clean) |
||
|
Surface Insulation Resistance 85 °C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 |
L: 100 M (no-clean) |
||
|
Viscosity - Malcom @ 10 RPM/25 °C (x103mPa/s) |
IPC-TM-650: 2.4.34.4 |
53-72 |
||
|
Visual |
IPC-TM-650: 3.4.2.5 |
Clear and free from precipitation |
||
|
Conflict Minerals Compliance |
Electronic Industry Citizenship Coalition (EICC) |
Compliant |
||
|
REACH Compliance |
Articles 33 and 67 of Regulation (EC) No 1907/2006 |
Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
||
Storage & Handling
Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12-month shelf life.