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Product Info
AMTECH RMA-223-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH RMA-223-TF may be used for BGA sphere attachment and reballing. AMTECH RMA-223-TF is also designed to work on all flip chip bumping and chip scale packaging sites.
Product Highlights:
- ROL0 flux classification
- Wide process window
- Excellent wetting compatibility on most board finishes
- Clear residue
-
High temperature compatible
Available Alloys
|
Alloy |
Temp °C |
Temp °F |
|
63Sn/37Pb |
183 |
361 |
|
62Sn/36Pb/2Ag |
179 |
354 |
|
62.8Sn/36.8Pb/0.4Ag |
179-183 |
354-361 |
|
60Sn/40Pb |
183-191 |
361-376 |
|
43Sn/43Pb/14Bi |
144-163 |
291-325 |
|
42Sn/58Bi |
138 |
280 |
Test Results
|
Test J-STD-004 or other requirements (as stated) |
Test Requirement |
Result |
||
|
Copper Mirror |
IPC-TM-650: 2.3.32 |
L: No breakthrough |
||
|
Corrosion |
IPC-TM-650: 2.6.15 |
L: No Corrosion |
||
|
Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
L: <0.5% |
||
|
Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (No-clean) |
||
|
Surface Insulation Resistance 85 oC, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 |
L: 100 M (No-clean) |
||
|
Tack Value |
IPC-TM-650: 2.4.44 |
35g |
||
|
Viscosity - Malcom @ 10 RPM/25 oC (x103mPa/s)- Sn63 T3/T4 |
IPC-TM-650: 2.4.34.4 |
Print: 195-300 Dispensing: 100-140 |
||
|
Visual |
IPC-TM-650: 3.4.2.5 |
Clear and free from precipitation |
||
|
Conflict Minerals Compliance |
Electronic Industry Citizenship Coalition (EICC) |
Compliant |
||
|
REACH Compliance |
Articles 33 and 67 of Regulation (EC) No 1907/2006 |
Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
||
Storage & Handling
Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12 month shelf life.
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