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PRODUCT INFO
AMTECH NC-559-V3 is the 3rd generation of the famous NC-559 tacky flux. Developed to achieve even better wetting and a clearer transparent residue, it is formulated for syringe application, stencil printing and rework processes on all PCB surface finishes. AMTECH NC-559-V3 performs excellent for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.
- ROL0 flux classification
- Wide process window
- Excellent wetting compatibility on most board finishes
- Clear residue
- High temperature compatible
Compatible Alloys
|
Alloy |
Temp °C |
Temp °F |
|
63Sn/37Pb |
183 |
361 |
|
62Sn/36Pb/2Ag |
179 |
354 |
|
62.8Sn/36.8Pb/0.4Ag |
179-183 |
354-361 |
|
60Sn/40Pb |
183-191 |
361-376 |
|
43Sn/43Pb/14Bi |
144-163 |
291-325 |
|
42Sn/58Bi |
138 |
280 |
|
10Sn/88Pb/2Ag |
268-290 |
514-554 |
Test Results
|
Test J-STD-004 or other requirements (as stated) |
Test Requirement |
Result |
|
Copper Mirror |
IPC-TM-650: 2.3.32 |
L: No breakthrough |
|
Corrosion |
IPC-TM-650: 2.6.15 |
L: No corrosion |
|
Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
L: No halogen |
|
Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (no-clean) |
|
Viscosity - Brookfield/20 °C Mobile F HELIPATH system, at 5 rpm |
IPC-TM-650: 2.4.34.4 |
Typical 400 |
|
Visual |
IPC-TM-650: 3.4.2.5 |
Clear and free from precipitation |
|
Conflict Minerals Compliance |
Electronic Industry Citizenship Coalition (EICC) |
Compliant |
|
REACH Compliance |
Articles 33 and 67 of Regulation (EC) No 1907/2006 |
May contain up to 7% w/w of ethoxylated 4-nonylphenol |
Process Recommendation
The best process will depend on factors such as operating conditions, equipment, board or component design. Our team is ready to advise you.
Reflow Guideline
This profile is designed to serve as a starting point for process optimization using NC-559-V3. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone, (140-180 °C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.
Cleaning Post Soldering
AMTECH NC-559-V3 is a no-clean tacky flux, so cleaning is not required to meet IPC standards. The chemistry is specially designed so that any remaining flux residue is chemically inert and will not impact your assembled board or packaging under normal conditions. However, when cleaning is desired or required (e.g. high reliability assembly or to improved conformal coating adhesion), the flux residue can be easily removed with Inventec’s own formulated flux cleaners.
|
Process Type |
PCBA Defluxing Solutions |
|
Manual |
QuicksolvTM DEF 90, QuicksolvTM DEF 70 (aerosol) |
|
Aqueous system (Immersion or spray) |
PromocleanTM DISPER 607, PromocleanTM DISPER 707, PromocleanTM DISPER 800 |
|
Co-solvent system |
TopkleanTM EL 20P or EL 20A + HFE bases solvents |
|
Mono-solvent (Azeotropic) |
PromosolvTM 70ES |
Other products are available, depending on specific customer requirements. Also check our maintenance cleaning solutions.
Health, Safety & Environment
No issues when used as recommended.
In accordance with the Annex II of Directive 2011/65/UE (RoHS), including its amendments, we certify that this product does not contain quantities above 0.1% of Hg, Pb, Cr VI, PBB, PBDE, DEHP, BBP, DBP, DIBP and above 0.01% of Cd. Inventec Performance Chemicals also fulfills its direct obligations under the REACH and Conflict Mineral regulations.