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PRODUCT INFO
Product Highlights
- REL1 flux classification
- Optimized for lead-free and standard alloy systems
- Wide process window
- Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)
- Excellent wetting compatibility on most boar finishes
- Low voiding, including LGA
- REACH compliant
Application
AMTECH 4300/LF-4300.2-TF is formulated for syringe, stencil, printing, and rework applications on all PCB surface finishes. AMTECH 4300/LF-4300.2-TF may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.
Compatible Alloys
| Alloy | Temp °C | Temp °F |
| 63Sn/37Pb | 183 | 361 |
| 62Sn/36Pb/2Ag | 179 | 354 |
| 62.8Sn/36.8Pb/0.4Ag | 179-183 | 354-361 |
| 42Sn/58Bi | 138 | 280 |
| 42Sn/57Bi/1Ag | 138 | 280 |
| 96.5Sn/3.0Ag/0.5Cu | 217-220 | 423-428 |
| 99.0Sn/0.3Ag/0.7Cu | 217-221 | 423-430 |
| 96.5Sn/3.5Ag | 221 | 430 |
| 99.3Sn/0.7Cu | 227 | 441 |
| 95Sn/%sB | 235-240 | 455-464 |
| 95Sn/5Ag | 221-245 | 430-473 |
Test Results
| Test J-STD-004 or other requirements (as stated) | Test Requirement | Result |
| Copper Mirror |
IPC-TM-650: 2.3.32 |
L: No breakthrough |
| Corrosion |
IPC-TM-650: 2.6.15 |
L: No corrosion |
| Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
L: <0.5% |
| Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (no-clean) |
| Surface Insulation Resistance 85 °C, 85% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 |
L: 100 M (no-clean) |
| Viscosity - Malcom @ 10 RPM/25 °C |
IPC-TM-650: 2.4.34.4 |
20-48 |
| Visual |
IPC-TM-650: 3.4.2.5 |
Clear and free from precipitation |
| Conflict Minerals Compliance |
Electronic Industry Citizenship Coalition (EICC) |
Compliant |
| REACH Compliance |
Articles 33 and 67 of Regulation (EC) No 1907/2006 |
Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
Cleaning
AMTECH 4300/LF-4300.2-TF is a water washable tacky flux that can be left on the board for many SMT assemblies. For applications requiring cleaning, AMTECH 4300/LF-4300.2-TF can be cleaned using di-ionized water at 40-60 °C with a recommended water pressure of 30-50 PSI. It can also be cleaned using commercially available flux residue removers such as Kyzen Aquanox A4241, A4520, A4625 and A4625B (Batch Cleaners). Kyzen brand cleaners are available from Amtech.
Storage & Handling
Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12-month shelf life.
Recommended Profile
This profile is designed to serve as a starting point for process optimization using AMTECH 4300/LF-4300.2-TF. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.