AMTECH LF-4300

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 Technical Data Sheet 

 Safety Data Sheet 

PRODUCT INFO

Product Highlights 

  • REL0 flux classification
  • Optimized for Lead-free and standard alloy systems 
  • Wide process window
  • Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)
  • Excellent wetting compatibility on most board finishes
  • Low voiding, Including LGA
  • REACH compliant

Application

4300/LF-4300-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. 4300/LF-4300-TF may be used for BGA sphere attachment and reballing. 4300/LF-4300-TF is also designed to work on all flip chip bumping and chip scale packaging sites.

 

Compatible Alloys 

 Alloy

Temp °C Temp °F
63Sn/37Pb 183 361
62Sn/36Pb/2Ag 179 354
62.8Sn/36.8Pb/0.4Ag 179-183 354-361
42Sn/58Bi 138 280
42Sn/57Bi/1Ag 138 280
96.5Sn/3.0Ag/0.5Cu 217-220 423-428
99.0Sn/0.3Ag/0.7Cu 217-221 423-430
96.5Sn/3.5Ag 221 430
99.3Sn/0.7Cu 227 441
95Sn/%sB 235-240 455-464
95Sn/5Ag 221-245 430-473

 

Test Results

Test J-STD-004 or other requirements (as stated)

Test Requirement

Result

Copper Mirror
IPC-TM-650: 2.3.32
L: No breakthrough
Corrosion
IPC-TM-650: 2.6.15
L: No corrosion
Quantitative Halides
IPC-TM-650: 2.3.28.1
L: <0.5%
Electrochemical Migration
IPC-TM-650: 2.6.14.1
L: <1 decade drop (no-clean)
Surface Insulation Resistance 85 °C, 85% RH @ 168 Hours
IPC-TM-650: 2.6.3.7
L: 100 M (no-clean)
Viscosity - Malcom @ 10 RPM/25 °C
IPC-TM-650: 2.4.34.4
20-48
Visual
IPC-TM-650: 3.4.2.5
Clear and free from precipitation
Conflict Minerals Compliance
Electronic Industry Citizenship Coalition (EICC)
Compliant
REACH Compliance
Articles 33 and 67 of Regulation (EC) No 1907/2006
  • Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials

 

Cleaning

4300/LF-4300-TF is a water washable tacky flux that can be left on the board for many SMT assemblies. For applications requiring cleaning, 4300/LF-4300-TF can be cleaned using di-ionized water at 40-60 o C with a recommended water pressure of 30-50 PSI. 4300/LF-4300-TF can also be cleaned using commercially available flux residue removers such INVENTEC Promoclean™ and Promosolv™ cleaning chemistries

 

Storage and Handling

Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12-month shelf life.

 

 

Recommended Profile

This profile is designed to serve as a starting point for process optimization using 4300/LF-4300-TF. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.

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