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PRODUCT INFO
- REM1 flux classification in a Water Washable Solder Paste
- Resists moisture absorption and humidity for up to 16 hours, helps prevent slumping, tombstoning, microballing, and “head and pillow”
- 24-hour stencil/tack life
- Flux residues are clear, easy-to-clean, and compatible with batch cleaning systems
- Exceptional print definition at high printing speeds up to 100mm/sec
- Low voiding, including LGA components
- RoHS II and REACH compliant
- Compatible with enclosed print heads
- Print and dispense grade solder paste available
Available Alloys
| Alloy | Temp °C | Temp °F |
| 42Sn/58Bi | 138 | 280 |
| 42Sn/57.6Bi/0.4Ag | 139-140 | 282-284 |
| 96.5Sn/3.0Ag/0.5Cu | 217-220 | 423-428 |
| 99.0Sn/0.3Ag/0.7Cu | 217-221 | 423-430 |
| 96.5Sn/3.5Ag | 221 | 430 |
| 99.3Sn/0.7Cu | 227 | 441 |
| 95Sn/5Sb | 235-240 | 455-464 |
| 95Sn/5Ag | 221-245 | 430-473 |
Test Results
| Test J-STD-004 or other requirements (as stated) | Test Requirement | Result |
| Copper Mirror |
IPC-TM-650: 2.3.32 | M: <50% breakthrough |
| Corrosion |
IPC-TM-650: 2.6.15 | M: Mirror corrosion (uncleaned) |
| Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
M: ≥0.05 and <0.5% |
| Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (cleaned) |
| Surface Insulation Resistance 40 °C, 90% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L: ≥100MΩ (cleaned) |
| Tack Value (initial/24 hrs) |
IPC-TM-650: 2.4.44 | 40g |
| Viscosity - Malcom @ 10 RPM/25 °C |
IPC-TM-650: 2.4.34.4 |
Print: 160-210 Dispensing: 80-115 |
| Visual |
IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of Regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
Printer Operation
The following are general guidelines for stencil printer optimization with LF-4300.2. Some adjustments may be necessary based on your process requirements.
Print Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Amtech Low Oxide Powder Distribution
| Micron Size | Type | Pitch Requirements |
| 45-75 | Type-2 |
24 mil and above |
| 25-45 | Type-3 |
16-24 mil |
| 20-38 |
Type-4 |
12-16 mil |
| 15-25 |
Type-5 |
8-12 mil |
| 5-15 |
Type-6 |
5-8 mil |
| 2-11 |
Type-7 |
< 5 mil |
Stencil Life
> 16 hours @ 30-45% RH and 20-25 °C, 24 hrs
~ 8 hours @ 45-75% RH and 20-25 °C, ~8 hrs
Cleaning
LF-4300.2 can be cleaned using deionized water at 40-60°C with a recommended water pressure of 30-50 PSI. LF-4300.2 can also be cleaned using flux residue removers such as Inventec Disper 607 and Disper 610.
Storage
Solder paste should be stored between 3-8 °C (37-46 °F) to obtain the maximum refrigerated shelf life of twelve months. Unopened solder paste stored at room temperature, 25 °C (77 °F) will have a one-month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down. Allow 4-8 hours for solder paste to reach an operating temperature of 20-25 °C (68-77 °F). Keep the solder paste container sealed while warming the solder paste to operating temperature. NEVER FREEZE SOLDER PASTE.
Recommended Profile
This profile is designed to serve as a starting point for process optimization using LF-4300.2. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone, (170-220 °C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <90 seconds.