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PRODUCT INFO
- REM1 flux classification in a Water Washable Solder PasteĀ
- Resists moisture absorption and humidity for upĀ to 16 hours, helps prevent slumping, tombstoning, microballing, and āhead and pillowā
- 24-hour stencil/tack lifeĀ
- Flux residues are clear, easy-to-clean, and compatible with batch cleaning systemsĀ
- Exceptional print definition at high printing speeds up to 100mm/secĀ
- Low voiding, including LGA components
- RoHS II and REACH compliantĀ
- Compatible with enclosed print headsĀ
- Print and dispense grade solder paste available
Available Alloys
| Alloy | Temp Ā°C | Temp Ā°F |
| 42Sn/58Bi | 138 | 280 |
| 42Sn/57.6Bi/0.4Ag | 139-140 | 282-284 |
| 96.5Sn/3.0Ag/0.5Cu | 217-220 | 423-428 |
| 99.0Sn/0.3Ag/0.7Cu | 217-221 | 423-430 |
| 96.5Sn/3.5Ag | 221 | 430 |
| 99.3Sn/0.7Cu | 227 | 441 |
| 95Sn/5Sb | 235-240 | 455-464 |
| 95Sn/5Ag | 221-245 | 430-473 |
Test Results
| Test J-STD-004 or other requirements (as stated) | Test Requirement | Result |
| Copper Mirror |
IPC-TM-650: 2.3.32 | M: <50% breakthrough |
| Corrosion |
IPC-TM-650: 2.6.15 | M: Mirror corrosion (uncleaned) |
| Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
M:Ā ā„0.05 and <0.5% |
| Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (cleaned) |
| Surface Insulation Resistance 40 Ā°C, 90% RH @ 168 Hours |
IPC-TM-650: 2.6.3.7 | L:Ā ā„100MĪ© (cleaned) |
| Tack Value (initial/24 hrs) |
IPC-TM-650: 2.4.44 | 40g |
| Viscosity - Malcom @ 10 RPM/25 Ā°C |
IPC-TM-650: 2.4.34.4 |
Print: 160-210 Dispensing: 80-115 |
| Visual |
IPC-TM-650: 3.4.2.5 | Clear and free from precipitation |
| Conflict Minerals Compliance | Electronic Industry Citizenship Coalition (EICC) | Compliant |
| REACH Compliance | Articles 33 and 67 of Regulation (EC) No 1907/2006 | Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
Printer Operation
The following are general guidelines for stencil printer optimization with LF-4300.2. Some adjustments may be necessary based on your process requirements.Ā
Print Speed: 25-100 mm/secĀ
Squeegee Pressure: 70-250g/cm of bladeĀ
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Amtech Low Oxide Powder Distribution
| Micron Size | Type | Pitch Requirements |
| 45-75 | Type-2 |
24 mil and above |
| 25-45 | Type-3 |
16-24 mil |
| 20-38 |
Type-4 |
12-16 mil |
| 15-25 |
Type-5 |
8-12 mil |
| 5-15 |
Type-6 |
5-8 mil |
| 2-11 |
Type-7 |
< 5 mil |
Stencil LifeĀ
> 16 hours @ 30-45% RH and 20-25 Ā°C, 24 hrs
~ 8 hours @ 45-75% RH and 20-25 Ā°C, ~8 hrs
CleaningĀ
LF-4300.2 can be cleaned using deionized water at 40-60Ā°C with a recommended water pressure of 30-50 PSI. LF-4300.2 can also be cleaned using flux residue removers such as Inventec Disper 607 and Disper 610.
StorageĀ
Solder paste should be stored between 3-8 Ā°C (37-46 Ā°F) to obtain the maximum refrigerated shelf life of twelve months. Unopened solder paste stored at room temperature, 25 Ā°C (77 Ā°F) will have a one-month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down. Allow 4-8 hours for solder paste to reach an operating temperature of 20-25 Ā°CĀ (68-77 Ā°F). Keep the solder paste container sealed while warming the solder paste to operating temperature. NEVER FREEZE SOLDER PASTE.
Recommended Profile
This profile is designed to serveĀ as a starting point for processĀ optimization using LF-4300.2.Ā To achieve better results withĀ voiding or to reduce tombstoning,Ā Ā consider using a longer soakingĀ zone, (170-220 Ā°C) for 60-90Ā seconds, with a rapid pre-heatĀ stage. If there is evidence of solderĀ de-wetting, consider lowering theĀ peak reflow temperature, or reduceĀ the time above liquidusĀ to <90 seconds.Ā