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PRODUCT INFO
Product Highlights
- ROL0 flux classification
- Designed for LGA, BGA, and CSP components
- Halogen-free per EN14582 test method
- Excellent wetting on all common surface finishes
- Clear residue
- Low voiding
- Long stencil life
- RoHS II and REACH compliant
Available Alloys
|
Test J-STD-004 or other requirements (as stated) |
Test Requirement |
Result |
|
Copper Mirror |
IPC-TM-650: 2.3.32 |
L: No breakthrough |
|
Corrosion |
IPC-TM-650: 2.6.15 |
L: No corrosion |
|
Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
L: <0.5% |
|
Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (No-clean) |
|
Surface Insulation Resistance |
IPC-TM-650: 2.6.3.7 |
L: 100 M (No Clean) |
|
85 °C, 85% RH@ 168 Hours |
|
|
|
Tack Value |
IPC-TM-650: 2.4.44 |
34g |
|
Viscosity - Malcom @ 10 RPM/25 °C (x103mPa/s)- SAC305 T3/T4 |
IPC-TM-650: 2.4.34.4 |
Print: 120-185 Dispensing: 105-150 |
|
Visual |
IPC-TM-650: 3.4.2.5 |
Clear and free from precipitation |
|
Conflict Minerals Compliance |
Electronic Industry Citizenship Coalition (EICC) |
Compliant |
|
REACH Compliance |
Articles 33 and 67 of Regulation (EC) No 1907/2006 |
Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
Printer Operation
The following are general guidelines for stencil printer optimization with VS-213A. Some adjustments may be necessary based on your process requirements.
- Print Speed: 25-150 mm/sec
- Squeegee Pressure: 70-250 g/cm of blade
- Under Stencil Wipe: Once every 10-25 prints, or as necessary
Amtech Low Oxide Powder Distribution
|
Micron Size |
Type |
Pitch Requirements |
|
45-75µ |
Type-2 |
24 mil and above |
|
25-45µ |
Type-3 |
16-24 mil |
|
20-38µ |
Type-4 |
12-16 mil |
|
15-25µ |
Type-5 |
8-12 mil |
|
5-15µ |
Type-6 |
5-8 mil |
|
2-11µ |
Type-7 |
< 5 mil |
Stencil Life
> 12 hours @ 30-45% RH and 20-25°C
~ 4 hours @ 45-75% RH and 20-25°C
Storage
Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored at room temperature (25°C / 77°F) will have a one-month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down. Allow 4-8 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature. NEVER FREEZE SOLDER PASTE.