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PRODUCT INFO
Product Highlights
- REL0 flux classification in a Water Washable Solder Paste
- Tier I Military/Avionic OEM approved
- Exceptional print definition at high printing speeds up to 100mm/sec
- Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)
- Clear residue
- Low voiding, including LGA components
- Low mid-chip beading
- REACH compliant
- Compatible with enclosed print heads
- Print and dispense grade solder paste available
Available Alloys
| Alloy | Temp °C | Temp °F |
| 63Sn/37Pb | 183 | 361 |
Test Results
|
Test J-STD-004 or other requirements (as stated) |
Test Requirement |
Result |
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Copper Mirror |
IPC-TM-650: 2.3.32 |
L: No breakthrough |
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Corrosion |
IPC-TM-650: 2.6.15 |
L: No corrosion |
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|
Quantitative Halides |
IPC-TM-650: 2.3.28.1 |
L: <.05% |
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|
Electrochemical Migration |
IPC-TM-650: 2.6.14.1 |
L: <1 decade drop (no-clean) |
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Surface Insulation Resistance 85 °C, 85% RH@ 168 Hours |
IPC-TM-650: 2.6.3.7 |
L: 100 M (no-clean) |
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Tack Value |
IPC-TM-650: 2.4.44 |
37g |
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Viscosity - Malcom @ 10 RPM/25 °C (x103mPa/s)- Sn63/Pb37 T3/T4 |
IPC-TM-650: 2.4.34.4 |
Print: 200-275 Dispensing: 100-140 |
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Visual |
IPC-TM-650: 3.4.2.5 |
Clear and free from precipitation |
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Conflict Minerals Compliance |
Electronic Industry Citizenship Coalition (EICC) |
Compliant |
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REACH Compliance |
Articles 33 and 67 of Regulation (EC) No 1907/2006 |
Contains no substance >0.1% w/w that is listed as a SVHC or restricted for use in solder materials |
Printer Operation
The following are general guidelines for stencil printer optimization with 4300. Some adjustments may be necessary based on your process requirements.
Print Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Amtech Low Oxide Powder Distribution
|
Micron Size |
Type |
Pitch Requirements |
|
45-75µ |
Type-2 |
24 mil and above |
|
25-45µ |
Type-3 |
16-24 mil |
|
20-38µ |
Type-4 |
12-16 mil |
|
15-25µ |
Type-5 |
8-12 mil |
|
5-15µ |
Type-6 |
5-8 mil |
|
2-11µ |
Type-7 |
< 5 mil |
Stencil Life
> 8 hours @ 30-45% RH and 20-25°C
~4 hours @ 45-75% RH and 20-25°C
Storage
Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored at room temperature, 25°C (77°F) will have a one-month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down. Allow 4-8 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature. NEVER FREEZE SOLDER PASTE.